Archon SB-E

Armor style heatsink fin array, with mirrored copper base, elevates heatsinks overall quality.
Optimized for high TDP of Next generation Intel Sandy Bridge-E (LGA2011) sockets.
Large heatsink fin array provides dissipating area of up to 150*125mm, making complete use of the airflow, with 150mm 140mm or 120mm fan.
With the max width of 55mm (heatsink only), tall memory heat spreaders are avoided.
Eight 6mm sintered heatpipe design, all heatpipes are nickel plated, to slow the oxidation deterioration to the heatpipe, to ensure longer usage and performance of the heatsink for the CPU.
Universal bracket system, allow users to mount to both Intel and AMD platforms
Includes one Thermalright TY-150 PWM fan, Ultra low noise at 23 dBA at max rpm (50cm testing distance)
The Archon package includes a tube of CF III Thermal paste, to provide the best combination for use with Archon.

Intel: Socket LGA 775/1150/1151/1155/1156/1366/2011/2011-3
AMD: Socket AM2/AM2 /AM3/AM3 /FM1/FM2


Product Description

Heatsink Specifications:
Dimension: L155 mm x W53.6 mm x H170.2 mm
Weight: 750g
Heat pipes: Eight 6mm Copper Heatpipes
Fin: T = 0.5 mm ; Gap = 1.9 mm
Fin Pcs: 28 6 5 = 39 pcs
Copper Base: C1100 Pure Copper Mirror Finished base with Nickel Plating
Motherboard to Fin: 27 8 = 35 mm

TY-150 FAN Spec
Dimension: L170 mm x W153 mm x H25.5 mm
Rated Speed: 500 – 1100 rpm
Weight: 180g
Noise Level: 22 – 34 dB(A)
Air Flow: 38.2 – 84.2 CFM Click to enlarge

Thermal design power: 320watt

Silent PC Review

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